• DocumentCode
    3382612
  • Title

    The effect of cell thickness on module reliability

  • Author

    Wohlgemuth, John H. ; Cunningham, Daniel W. ; Placer, Neil V. ; Kelly, George J. ; Nguyen, Andy M.

  • Author_Institution
    BP Solar International, Frederick, MD 21703 USA
  • fYear
    2008
  • fDate
    11-16 May 2008
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    This paper addresses the issue of the reliability of modules using ultra-thin crystalline silicon cells. Do thin cells have a greater likelihood of cracking during production, transport, installation or use and if so does this result in long term degradation of the power? The present qualification test sequence, IEC 61215 does not adequately address this issue, The only mechanical test in IEC 61215 is a static mechanical load test consisting of three load cycles that are performed after the accelerated stress tests. So even if this mechanical load test does break cells, it is unlikely to result in significant power loss. BP Solar has developed a test sequence for evaluation of cracked cells in PV modules. The test sequence incorporates a dynamic mechanical load test performed before the 50 thermal cycles/10 humidity freeze cycles of IEC 61215. Usually there is no significant power loss after the dynamic load testing. However, the subsequent thermal cycling opens up the cracks that propagated during the dynamic load test resulting in significant power loss. Having a test sequence that identifies damaged cells allows us to develop processes and handling procedures to minimize or eliminate damage to the ultra-thin cells, resulting in reliable modules.
  • Keywords
    Crystallization; Degradation; IEC standards; Life estimation; Performance evaluation; Production; Qualifications; Silicon; Testing; Thermal loading;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Photovoltaic Specialists Conference, 2008. PVSC '08. 33rd IEEE
  • Conference_Location
    San Diego, CA, USA
  • ISSN
    0160-8371
  • Print_ISBN
    978-1-4244-1640-0
  • Electronic_ISBN
    0160-8371
  • Type

    conf

  • DOI
    10.1109/PVSC.2008.4922770
  • Filename
    4922770