Title :
Small Silicon Condenser Microphone Improved with a Backchamber with Concave Lateral Sides
Author :
Kasai, Takashi ; Tsurukame, Yoshitaka ; Takahashi, Toshiyuki ; Sato, Fumihiko ; Horiike, Sumio
Author_Institution :
OMRON Corp., Kyoto
Abstract :
We have developed a very small, high-sensitivity silicon condenser microphone, in which a back chamber with concave lateral sides and a specific diaphragm were used as improvements. The concave sides increase the volume of the back chamber and thus solve the trade-off between chip downsizing and sensitivity. The novel back chamber was fabricated using a combination of isotropic and anisotropic etching. The diaphragm is supported only at the four corners to yield good deformation. The chip is 1.2 mmtimes1.3 mmtimes0.4 mm. The sensitivity is -41 dBV (8.8 mV/Pa) at 1 kHz and the frequency response is flat between 100 Hz and 10 kHz.
Keywords :
deformation; etching; microphones; silicon; Si; anisotropic etching; backchamber; concave lateral sides; deformation; small silicon condenser microphone; Anisotropic magnetoresistance; Electrodes; Equivalent circuits; Frequency response; Microphones; Shape; Silicon; Springs; Ventilation; Wet etching; backchamber; diaphragm; silicon microphone; wet etching;
Conference_Titel :
Solid-State Sensors, Actuators and Microsystems Conference, 2007. TRANSDUCERS 2007. International
Conference_Location :
Lyon
Print_ISBN :
1-4244-0842-3
Electronic_ISBN :
1-4244-0842-3
DOI :
10.1109/SENSOR.2007.4300707
