• DocumentCode
    3383179
  • Title

    Formation of fire-through silver metal contacts on the porous silicon surface for silicon solar cells

  • Author

    Vinod, P.N.

  • Author_Institution
    Naval Physical Oceanographic Laboratory, Thrikkakara P.O, Cochin 682 021, India
  • fYear
    2008
  • fDate
    11-16 May 2008
  • Firstpage
    1
  • Lastpage
    5
  • Abstract
    In the present study, the ohmic and microstructural properties of the fire-through Ag metal contacts formed on planar and thin layers of the porous silicon for the silicon solar cells are investigated. The SEM characterization of the Ag contacts shows that sintering of the contacts at high temperature enables to fire-through the applied Ag paste onto the etched porous silicon surface an results a good ohmic contact between the Ag metal and the n+-S surface. It shows that the interaction of the Ag conductor paste with the porous silicon follows a preferential reaction due to the high etch-rate of the molten glass-frit contained in the Ag paste. The specific contact resistance (ρc) of the Ag metal/PS/n+ Si contact structure was estimated using the extrapolation technique based on the three-point probe method. It shows that ρc = = 1.025 × 10−4 Ω-cm2 is obtained for contacts sintered at 825 °C for 90 sec in air ambient while contacts sintered at 750 °C has resulted ρc = 12.0 ×10−2 Ω-cm2. The ohmic losses of the contact structure were calculated based on the methodology for the relative power loss algorithm that accounts the total ohmic loss associated with the current traveling through various resistive components of the screen-printed solar cell normalized to the unit cell area.
  • Keywords
    Conductors; Contact resistance; Etching; Extrapolation; Ohmic contacts; Photovoltaic cells; Silicon; Silver; Surface resistance; Temperature; Antireflection coating; Ohmic contacts and sintering; solar cell;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Photovoltaic Specialists Conference, 2008. PVSC '08. 33rd IEEE
  • Conference_Location
    San Diego, CA, USA
  • ISSN
    0160-8371
  • Print_ISBN
    978-1-4244-1640-0
  • Electronic_ISBN
    0160-8371
  • Type

    conf

  • DOI
    10.1109/PVSC.2008.4922799
  • Filename
    4922799