Contact properties of the spring probe for probing on a solder bump

Author

Kasukabe, Susumu ; Harada, Shoichiro ; Maruyama, Tetuya ; Takagi, Ryuichi

Author_Institution

Hitachi Ltd., Yokohama, Japan

fYear

1992

fDate

18-21 Oct. 1992

Firstpage

187

Lastpage

190

Abstract

Flip-chip solder bumps are formed on the area array electrodes of high-speed computer LSI chips. A high-density spring probe (600 probes/9 mm*9 mm) was developed for testing these LSIs by vertical insertion into the solder bumps. Solder with an extremely high lead content is used to lengthen the life for the soldered joint. This oxidized lead with high resistivity causes poor contact. Probing tests are conducted to find a suitable probe tip shape and processing conditions for 97 Pb/3 Sn solder bumps. Probe tips with adequately small opening angles easily break through the oxide film covering the solder surface and obtain sufficient contact area with the new surface of the solder bump. By using a probe with a tip opening angle of 30 degrees , contact resistance remains stable when a probe is inserted into a solder bump before melting into a spherical shape.<>

Keywords

contact resistance; electrical contacts; flip-chip devices; integrated circuit technology; integrated circuit testing; large scale integration; life testing; probes; soldering; PbSn solder; area array electrodes; contact resistance; flip chip solder bumps; high-speed computer LSI chips; melting; oxide film; probe tip shape; probing test; resistivity; solder joint life; spherical shape; spring probe; tip opening angle; Conductivity; Electrodes; Large scale integration; Lead; Probes; Shape; Springs; Surface resistance; Testing; Tin;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Contacts, 1992., Proceedings of the Thirty-Eighth IEEE Holm Conference on

Conference_Location

Philadelphia, PA, USA

Print_ISBN

0-7803-0576-0

Type

conf

DOI

10.1109/HOLM.1992.246916

Filename

246916