DocumentCode
3384255
Title
A novel soft error sensitivity characterization technique based on simulated fault injection and constrained association analysis
Author
Sheng, Weiguang ; Xiao, Liyi ; Mao, Zhigang
Author_Institution
Micro Electron. Center, Harbin Inst. of Technol., Harbin
fYear
2008
fDate
Aug. 31 2008-Sept. 3 2008
Firstpage
766
Lastpage
769
Abstract
Soft error, a concern for space applications in the past, became a critical issue in deep sub-micron VLSI design for the continuous technology scaling. Automated fault injection technique is employed to characterize the soft error sensitivity of VHDL based design and association analysis algorithm is firstly introduced into this realm to explore the fault dependency of the components in the design. The association analysis technique makes the soft error characterization more systematic and methodic. An automated simulation based fault injector HSECT (HIT Soft Error Characterization Toolkit) is designed and a simple RISC processor, DP32-processor is selected as the research prototype. By using HSECT, 30,000 soft errors are injected to the DP32-processor with good statistical significance. The soft error sensitivity of the processor and the fault dependency of its components are also further investigated to direct the future design of the fault-tolerant and dependable circuits.
Keywords
VLSI; hardware description languages; integrated circuit reliability; microprocessor chips; reduced instruction set computing; DP32-processor; RISC processor; VHDL based design; automated fault injection technique; constrained association analysis algorithm; deep submicron VLSI design; simulated fault injection; soft error sensitivity characterization technique; Algorithm design and analysis; Analytical models; Circuit faults; Circuit simulation; Data mining; Independent component analysis; Reduced instruction set computing; Space technology; Very large scale integration; Virtual prototyping;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics, Circuits and Systems, 2008. ICECS 2008. 15th IEEE International Conference on
Conference_Location
St. Julien´s
Print_ISBN
978-1-4244-2181-7
Electronic_ISBN
978-1-4244-2182-4
Type
conf
DOI
10.1109/ICECS.2008.4674966
Filename
4674966
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