Title :
Partial discharge patterns and surface deterioration in voids in filled and unfilled epoxy
Author :
Holboll, J.T. ; Henriksen, M.
Author_Institution :
Dept. of Electr. Power Eng., Tech. Univ. of Denmark, Lyngby, Denmark
Abstract :
Results are presented from analyses of pulses from partial discharges (PDs) in single spherical voids in filled and unfilled epoxy plastic and related to the observed surface deterioration. The filler types used were dolomite, alumina, and silica. Long-time aging tests including pulse phase/height analyses were performed over a period of 2400 h and showed very characteristic discharge patterns for each material combination. A unique behavior with regard to changes of pulse repetition rate and maximum apparent charge was observed for PD in alumina- and silica-filled epoxy. The void surfaces were investigated by scanning electron microscopy for voids exposed to PD as well as voids without discharges. Different kinds of surface deterioration were found. An attempt was made to establish a relationship between aging phenomena as exhibited by void surface changes and discharge patterns
Keywords :
ageing; composite insulating materials; filled polymers; insulation testing; organic insulating materials; partial discharges; plastics; scanning electron microscope examination of materials; surface structure; voids (solid); 2400 h; alumina-filled epoxy; changes of pulse repetition rate; dolomite-filled epoxy; filled epoxy plastic; long-time aging tests; maximum apparent charge; partial discharge patterns; pulse phase/height analyses; scanning electron microscopy; silica-filled epoxy; single spherical voids; surface deterioration; unfilled epoxy; Aging; Materials testing; Partial discharges; Pattern analysis; Performance analysis; Performance evaluation; Phase change materials; Plastics; Silicon compounds; Surface discharges;
Conference_Titel :
Electrical Insulation, Conference Record of the 1992 IEEE International Symposium on
Conference_Location :
Baltimore, MD
Print_ISBN :
0-7803-0649-X
DOI :
10.1109/ELINSL.1992.246977