• DocumentCode
    3384702
  • Title

    3D floorplan design

  • Author

    Wong, Martin D F

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Univ. of Illinois at Urbana-Champaign, Urbana, IL, USA
  • fYear
    2009
  • fDate
    23-25 July 2009
  • Firstpage
    1097
  • Lastpage
    1097
  • Abstract
    This talk focuses on the floorplan design problem for 3D ICs. The traditional 2D floorplan design problem has been extensively studied in the past 30 years. We first give a brief overview of the history of 2D floorplan design. We then point out some lessons that we can learn from these prior research efforts which potentially will benefit research in 3D floorplan design.
  • Keywords
    circuit CAD; integrated circuit design; 3D floorplan design; IC design; computer-aided circuit design; Algorithm design and analysis; Books; Computer science; Design automation; Design optimization; History; Integrated circuit interconnections; Mathematics; Routing; Very large scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Communications, Circuits and Systems, 2009. ICCCAS 2009. International Conference on
  • Conference_Location
    Milpitas, CA
  • Print_ISBN
    978-1-4244-4886-9
  • Electronic_ISBN
    978-1-4244-4888-3
  • Type

    conf

  • DOI
    10.1109/ICCCAS.2009.5250322
  • Filename
    5250322
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3384702