Title :
Routability-driven RDL routing with pin reassignment
Author :
Yan, Jin-Tai ; Chen, Ke-Chyuan ; Chen, Zhi-Wei
Author_Institution :
Dept. of Comput. Sci. & Inf. Eng., Chung-Hua Univ., Hsinchu, Taiwan
Abstract :
Due to the infeasible pre-assignment of IO connections in a flip-chip design, all the published RDL routers cannot guarantee 100% routability for the pre-assigned IO connections. In this paper, based on two swapping processes for pin reassignment, the unroutable conditions in a flip-chip design can be eliminated. Furthermore, by using the assignment of routability-driven transfer and boundary pins, a given set of pre-assigned IO connections between the wire-bonding pads and the bump balls can be completely routed to minimize the total wirelength with 100% routability in a flip-chip design.
Keywords :
flip-chip devices; integrated circuit design; lead bonding; RDL routers; boundary pins; bump balls; flip-chip design; pin reassignment; pre-assigned IO connections; redistribution layer; routability-driven RDL routing; routability-driven transfer; swapping processes; unroutable conditions; wire-bonding pads; Arrays; Bonding; Pins; Routing; Sorting; Wires;
Conference_Titel :
SOC Conference (SOCC), 2010 IEEE International
Conference_Location :
Las Vegas, NV
Print_ISBN :
978-1-4244-6682-5
DOI :
10.1109/SOCC.2010.5784746