DocumentCode :
3384830
Title :
Throughput estimation for ModelSim simulator tool based HW/SW co-verification system
Author :
Ruan, A.W. ; Liao, Y.B. ; Li, P. ; Li, W.C. ; Li, W.
Author_Institution :
State Key Lab. of Electron. Films & Integrated Devices, Univ. of Electron. Sci. & Technol. of China, Chengdu, China
fYear :
2009
fDate :
23-25 July 2009
Firstpage :
1014
Lastpage :
1018
Abstract :
Efficient and reliable verification system is requested for a system-on-chip (SOC) design before it is committed to production. The intention of the paper is to judge whether our hardware/software (HW/SW) co-verification system can handle SOC verification and provide the necessary performance in terms of co-verification speed and throughput. A finite impulse response (FIR) filter is utilized as a device-under-test (DUT) to compare pure software simulation, ModelSim simulator in this case, and HW/SW co-verification approaches to decide on whether the HW/SW co-verification system can work or not. Experiment result demonstrates the more complicated SOC is, the greater the potential speedup of the co-verification approach over software simulation is. However, the communication between software and hardware in HW/SW co-verification system is a major bottleneck, which may offset the acceleration achieved by moving large computation from software side to hardware side.
Keywords :
FIR filters; hardware-software codesign; integrated circuit design; system-on-chip; ModelSim simulator tool; device-under-test; finite impulse response filter; hardware/software coverification system; system-on-chip design; throughput estimation; Communication system software; Electronic design automation and methodology; Field programmable gate arrays; Finite impulse response filter; Hardware; Software performance; Software testing; Software tools; System-on-a-chip; Throughput;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Communications, Circuits and Systems, 2009. ICCCAS 2009. International Conference on
Conference_Location :
Milpitas, CA
Print_ISBN :
978-1-4244-4886-9
Electronic_ISBN :
978-1-4244-4888-3
Type :
conf
DOI :
10.1109/ICCCAS.2009.5250328
Filename :
5250328
Link To Document :
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