Design of on-chip microwave filters in integrated fan-out wafer level packaging (InFO-WLP) technology

Author

Chi-Kai Shen ; Ming-Hsien Tsai ; Huan-Neng Chen ; Chewn-Pu Jou ; Liu, Sally ; Fu-Lung Hsueh ; Tzong-Lin Wu

Author_Institution

Dept. of Electr. Eng. & Grad., Nat. Taiwan Univ., Taipei, Taiwan

fYear

2015

fDate

26-29 May 2015

Firstpage

246

Lastpage

248

Abstract

This paper investigates the microwave lowpass filters in integrated fan-out wafer-level packaging (InFO-WLP) technology. The Chebyshev prototype is adopted to achieve sharp cutoff at the edge of passband. A lumped-LC structure and three different distributed structures, including λ/8 stubs, stepped-impedance, and periodic tapered electromagnetic bandgap (EBG), are employed to find an appropriate microwave LPF realized in InFO-WLP technology. The simulation results exhibit the proposed LPF using lumped-LC structure can achieve the smallest size with the accepted ripple in passband and good suppression in stopband at the cutoff frequency of ~ 10 GHz. To the best of authors´ knowledge, this is the first to study microwave filters in InFO-WLP technology.

Keywords

Chebyshev filters; LC circuits; low-pass filters; microwave filters; photonic band gap; wafer level packaging; Chebyshev prototype; EBG; InFO-WLP technology; cutoff frequency; distributed structure; integrated fan-out wafer level packaging; lumped-LC structure; microwave LPF; microwave lowpass filter; on-chip microwave filter; passband; periodic tapered electromagnetic bandgap; stepped-impedance; stopband; Chebyshev prototype; electromaganetic bandgap (EBG); integrated fan-out wafer-level packaging (InFO-WLP); lowpass filter (LPF); microstrip fiter; step-impedance; tapered structure;

fLanguage

English

Publisher

ieee

Conference_Titel

Electromagnetic Compatibility (APEMC), 2015 Asia-Pacific Symposium on

Conference_Location

Taipei

Print_ISBN

978-1-4799-6668-4

Type

conf

DOI

10.1109/APEMC.2015.7175404

Filename

7175404