DocumentCode
3385134
Title
A distributed regulated power conversion topology to avoid thermal talk with core loads
Author
Mandal, Sajal Kumar
Author_Institution
STMicroelectronics, Noida
fYear
2008
fDate
Aug. 31 2008-Sept. 3 2008
Firstpage
970
Lastpage
973
Abstract
A distributed linear regulator topology is presented to achieve uniform die temperature to avoid thermal talk between the power converter and the core loads. The topology is validated in 90 nm CMOS technology to supply 200 mA current to core load working at 1.2 V from an unregulated supply varying between 1.62 V to 3.1 V.
Keywords
CMOS integrated circuits; power convertors; CMOS technology; core load working; core loads; die temperature; distributed regulated power conversion topology; power converter; size 90 nm; voltage 1.62 V to 3.1 V; CMOS technology; Circuit stability; Circuit topology; Land surface temperature; Power conversion; Rapid thermal processing; Regulators; Routing; Thermal loading; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics, Circuits and Systems, 2008. ICECS 2008. 15th IEEE International Conference on
Conference_Location
St. Julien´s
Print_ISBN
978-1-4244-2181-7
Electronic_ISBN
978-1-4244-2182-4
Type
conf
DOI
10.1109/ICECS.2008.4675017
Filename
4675017
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