DocumentCode :
3385588
Title :
The effects of metal oxides on thermal stabilization of EPDM insulation compounds
Author :
Hattori, R.S. ; Goncalves, J.F.
Author_Institution :
Pirelli Res. & Dev. Center, Santo Andre, Brazil
fYear :
1992
fDate :
7-10 Jun 1992
Firstpage :
173
Lastpage :
176
Abstract :
The efficiency of two metal oxides, red lead and zinc oxide, and their binary mixture as thermal stabilizers in an ethylene-propylene-diene-monomer (EPDM)-based compound for high-voltage insulating cable has been investigated. Mechanical characteristics were monitored during long term aging up to the point of obtaining both 50% retention of tensile strength and elongation at break. It was possible to identify the best metal oxide combination for improved compound thermal stability. Tinned copper conductor insulated wires, not aged, were submitted to an electrical moisture absorption test at 90°C in accordance with AEIC CS 6-79. The electrical behavior of the tested compounds was compared on the basis of the loss tangent and permittivity results. By analyzing the electrical and thermal behavior it was possible to establish the best metal oxides composition for an EPDM-based compound
Keywords :
ageing; cable insulation; dielectric losses; elongation; insulation testing; moisture; organic insulating materials; permittivity; rubber; tensile strength; 110 to 190 C; AEIC CS 6-79; Arrhenius plot; EPDM insulation compounds; Pb3O4; ZnO; ageing temperature; binary mixture; curing; electrical moisture absorption test; elongation; ethylene-propylene-diene-monomer; high-voltage insulating cable; long term ageing; loss tangent; mechanical characteristics; metal oxide effect; metal oxides composition; permittivity; rubber; tensile strength; thermal stability; tinned Cu conductor; Aging; Cable insulation; Conductors; Copper; Dielectrics and electrical insulation; Lead compounds; Monitoring; Testing; Thermal stability; Zinc oxide;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Insulation, Conference Record of the 1992 IEEE International Symposium on
Conference_Location :
Baltimore, MD
ISSN :
1089-084X
Print_ISBN :
0-7803-0649-X
Type :
conf
DOI :
10.1109/ELINSL.1992.247026
Filename :
247026
Link To Document :
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