Modeling of bulk and micromachined lumped elements for microwave and millimeter wave frequencies

Author

Marcelli, Romolo ; Bartolucci, G.

Author_Institution

CNR, Rome

Volume

2

fYear

1999

fDate

36434

Firstpage

439

Abstract

Bulk and micromachined lumped elements have been designed and realized on silicon and GaAs wafers. S and Meander inductors, and interdigital capacitors with eight and sixteen fingers have been obtained. These components have been characterized up to 40 GHz by means of an on wafer measurement system. The modeling has been developed by using the commercial software package HP Microwave Design System (HP-MDS) to exploit the possibilities for the simulation of lumped components utilizing coupled line elements, right angle bends and tee-junctions

Keywords

III-V semiconductors; capacitors; digital simulation; elemental semiconductors; gallium arsenide; inductors; micromachining; micromechanical devices; microstrip components; microwave devices; microwave measurement; millimetre wave devices; semiconductor device models; silicon; 40 GHz; GaAs; GaAs wafers; HP Microwave Design System; S inductors; Si; bulk lumped elements; coupled line elements; fingers; interdigital capacitors; meander inductors; micromachined lumped elements; microwave frequencies; millimeter wave frequencies; modelling; on-wafer measurement system; right angle bends; silicon; software package; tee-junctions; Active inductors; Analytical models; Biomembranes; Capacitors; Frequency; Gallium arsenide; Microstrip; Microwave technology; Millimeter wave technology; Silicon;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Conference, 1999. CAS '99 Proceedings. 1999 International

Conference_Location

Sinaia

Print_ISBN

0-7803-5139-8

Type

conf

DOI

10.1109/SMICND.1999.810581

Filename

810581