• DocumentCode
    3386033
  • Title

    Accelerated life studies of polyimide film under electrical and thermal multistress

  • Author

    Laghari, J.R. ; Cygan, P.J.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., State Univ. of New York, Buffalo, NY, USA
  • fYear
    1992
  • fDate
    7-10 Jun 1992
  • Firstpage
    66
  • Lastpage
    69
  • Abstract
    Accelerated life studies on a high-temperature polyimide film (Kapton) were conducted under simultaneous electrical and thermal stress at 60 Hz and 400 Hz. The breakdown strength and the aging characteristics were obtained at test temperatures of 23°C, 100°C and 200°C. The two-parameter Weibull distribution was used in the evaluation of the experimental data. The experimental results show that electrical aging, by increasing the applied voltage or the applied frequency, is the mechanism responsible for failure under these conditions, and that thermal aging is not a major degradation factor for the Kapton film in the applied temperature range, particularly at the higher frequency of 400 Hz. Several theoretical models were considered to obtain the best approximation to the experimental data. The analysis shows that present physical models cannot take into account acceleration of aging with the applied frequency
  • Keywords
    electric breakdown of solids; electric strength; insulating thin films; insulation testing; life testing; organic insulating materials; polymer films; thermal stresses; 100 C; 200 C; 23 C; 400 Hz; 60 Hz; Kapton film; accelerated life testing; applied frequency; applied voltage; breakdown strength; electrical ageing; electrical stress; high-temperature polyimide film; polyimide film; theoretical models; thermal ageing; thermal stress; two-parameter Weibull distribution; Accelerated aging; Acceleration; Conductive films; Electric breakdown; Frequency; Life estimation; Life testing; Polyimides; Thermal conductivity; Thermal stresses;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation, Conference Record of the 1992 IEEE International Symposium on
  • Conference_Location
    Baltimore, MD
  • ISSN
    1089-084X
  • Print_ISBN
    0-7803-0649-X
  • Type

    conf

  • DOI
    10.1109/ELINSL.1992.247050
  • Filename
    247050