Title :
Impact of module design on the signal-isolation of mixed-signal RF applications
Author :
Secareanu, Radu M. ; Yang, Jian ; Li, Qiang ; Briones, Luis ; Eid, Salem ; Jean-Stephane, Vigier ; Hartin, Olin
fDate :
May 30 2010-June 2 2010
Abstract :
The functionality of a mixed-signal RF application can be compromised due to signal integrity aspects. A well-designed mixed-signal RF application at the chip level can miss specs when integrated on a substrate (module). In this paper, a study of connectivity and parasitics at the module level is presented, and conclusions are drawn.
Keywords :
integrated circuit design; mixed analogue-digital integrated circuits; modules; mixed-signal RF functionality; module design; signal integrity; signal isolation; Capacitors; Circuits; Logic; Packaging; RF signals; Radio frequency; Routing; Signal design; Silicon; Substrates;
Conference_Titel :
Circuits and Systems (ISCAS), Proceedings of 2010 IEEE International Symposium on
Conference_Location :
Paris
Print_ISBN :
978-1-4244-5308-5
Electronic_ISBN :
978-1-4244-5309-2
DOI :
10.1109/ISCAS.2010.5537743
