• DocumentCode
    3386217
  • Title

    Design of the insulation system in space lasers against surface tracking

  • Author

    Wang, F. ; Cheng, T.C.

  • Author_Institution
    Univ. of Southern California, Los Angeles, CA, USA
  • fYear
    1992
  • fDate
    7-10 Jun 1992
  • Firstpage
    28
  • Lastpage
    30
  • Abstract
    The authors deal with the design of a space laser insulation system using surface tracking as the constraint. Various parameters that determine the surface tracking distance between the high-potential electrode and the ground pins were identified and studied. Computer simulations were used to simulate the electric field distribution with various electrical, environmental, and material parameters. A design guideline is devised based on a detailed 3-D simulation of the electric field, and a sample calculation is presented for an actual space laser. It was found that an insulating material with higher permittivity and better chemical stability, such as alumina, will result in a smaller tracking distance
  • Keywords
    electric breakdown of solids; electric strength; environmental degradation; insulation; laser accessories; surface discharges; Al2O3; chemical stability; computer simulation; design guideline; electric breakdown; electric field 3D simulation; electric field distribution; electric strength; electrical parameters; environmental parameters; ground pins; high-potential electrode; insulating material; material parameters; permittivity; simulation system design; space laser insulation system; surface tracking; surface tracking distance; teflon; Chemical lasers; Computational modeling; Computer simulation; Electrodes; Guidelines; Insulation life; Optical design; Optical materials; Pins; Surface emitting lasers;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation, Conference Record of the 1992 IEEE International Symposium on
  • Conference_Location
    Baltimore, MD
  • ISSN
    1089-084X
  • Print_ISBN
    0-7803-0649-X
  • Type

    conf

  • DOI
    10.1109/ELINSL.1992.247059
  • Filename
    247059