DocumentCode :
3387027
Title :
Rationale for optical interconnect
Author :
Scandurra, Alberto
Author_Institution :
On-Chip Commun. Syst. (OCCS), STMicroelectronics, Catania, Italy
fYear :
2010
fDate :
May 30 2010-June 2 2010
Firstpage :
3597
Lastpage :
3600
Abstract :
The System on Chip (SoC) approach is now the essential solution for delivering competitive performance and cost in today´s challenging electronics market. Ever-increasing integration density means that many design and fabrication issues arise however, and the electrical limits of interconnect wires are in particular a limiting factor for performance. According to this scenario, a new technology is required for the on-chip interconnect, in order to overcome current physical and performance issues; one possible solution is optical interconnect, exploiting the many benefits of light as vector to transport information across the chip. From an industrial point of view, it is fundamental that such a new technology be fully CMOS compatible, in order to be able to continue to use current SoC design methodologies as well as manufacturing equipments for the remaining electronic part of the chip.
Keywords :
integrated circuit design; optical interconnections; system-on-chip; SoC design; design issues; electronics market; fabrication issues; integration density; limiting factor; manufacturing equipment; on-chip interconnect; optical interconnect; system on chip; CMOS technology; Consumer electronics; Costs; Design methodology; Electronics industry; Manufacturing industries; Optical device fabrication; Optical interconnections; System-on-a-chip; Wires;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Circuits and Systems (ISCAS), Proceedings of 2010 IEEE International Symposium on
Conference_Location :
Paris
Print_ISBN :
978-1-4244-5308-5
Electronic_ISBN :
978-1-4244-5309-2
Type :
conf
DOI :
10.1109/ISCAS.2010.5537790
Filename :
5537790
Link To Document :
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