Title :
Tools and methodologies for designing energy-efficient photonic networks-on-chip for highperformance chip multiprocessors
Author :
Chan, Johnnie ; Hendry, Gilbert ; Biberman, Aleksandr ; Bergman, Keren
Author_Institution :
Dept. of Electr. Eng., Columbia Univ., New York, NY, USA
fDate :
May 30 2010-June 2 2010
Abstract :
Photonic interconnection networks have recently been proposed as a replacement to conventional electronic network-on-chip solutions in delivering the ever increasing communication requirements of future chip multiprocessors. While photonics offers superior bandwidth density, lower latencies, and improvements in energy efficiency over electronics, the photonic network designs that can leverage these benefits cannot be easily derived by simply mimicking electronic layouts. In fact, proper implementations of photonic interconnects will require the careful consideration of a variety new physical-layer metrics and design requirements that did not exist with electronics. Here, we review some of the currently proposed designs for chip-scale photonic interconnection networks, the design methodologies required to produce viable network topologies, and a simulation environment, called PhoenixSim, that we have developed to accurately model and study those metrics and designs.
Keywords :
integrated optics; integrated optoelectronics; microprocessor chips; multiprocessing systems; network-on-chip; optical interconnections; PhoenixSim; bandwidth density; chip-scale photonic interconnection networks; electronic layouts; electronic network-on-chip solutions; energy-efficient photonic networks-on-chip design; high-performance chip multiprocessors; network topology; Bandwidth; Design methodology; Energy efficiency; Multiprocessor interconnection networks; Network-on-a-chip; Optical buffering; Optical crosstalk; Optical filters; Optical interconnections; Stimulated emission;
Conference_Titel :
Circuits and Systems (ISCAS), Proceedings of 2010 IEEE International Symposium on
Conference_Location :
Paris
Print_ISBN :
978-1-4244-5308-5
Electronic_ISBN :
978-1-4244-5309-2
DOI :
10.1109/ISCAS.2010.5537792