DocumentCode
3387059
Title
Tools and methodologies for designing energy-efficient photonic networks-on-chip for highperformance chip multiprocessors
Author
Chan, Johnnie ; Hendry, Gilbert ; Biberman, Aleksandr ; Bergman, Keren
Author_Institution
Dept. of Electr. Eng., Columbia Univ., New York, NY, USA
fYear
2010
fDate
May 30 2010-June 2 2010
Firstpage
3605
Lastpage
3608
Abstract
Photonic interconnection networks have recently been proposed as a replacement to conventional electronic network-on-chip solutions in delivering the ever increasing communication requirements of future chip multiprocessors. While photonics offers superior bandwidth density, lower latencies, and improvements in energy efficiency over electronics, the photonic network designs that can leverage these benefits cannot be easily derived by simply mimicking electronic layouts. In fact, proper implementations of photonic interconnects will require the careful consideration of a variety new physical-layer metrics and design requirements that did not exist with electronics. Here, we review some of the currently proposed designs for chip-scale photonic interconnection networks, the design methodologies required to produce viable network topologies, and a simulation environment, called PhoenixSim, that we have developed to accurately model and study those metrics and designs.
Keywords
integrated optics; integrated optoelectronics; microprocessor chips; multiprocessing systems; network-on-chip; optical interconnections; PhoenixSim; bandwidth density; chip-scale photonic interconnection networks; electronic layouts; electronic network-on-chip solutions; energy-efficient photonic networks-on-chip design; high-performance chip multiprocessors; network topology; Bandwidth; Design methodology; Energy efficiency; Multiprocessor interconnection networks; Network-on-a-chip; Optical buffering; Optical crosstalk; Optical filters; Optical interconnections; Stimulated emission;
fLanguage
English
Publisher
ieee
Conference_Titel
Circuits and Systems (ISCAS), Proceedings of 2010 IEEE International Symposium on
Conference_Location
Paris
Print_ISBN
978-1-4244-5308-5
Electronic_ISBN
978-1-4244-5309-2
Type
conf
DOI
10.1109/ISCAS.2010.5537792
Filename
5537792
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