Title :
Using life-cycle information for reliability assessment of electronic assemblies
Author :
Middendorf, A. ; Griese, H. ; Reichl, H. ; Grim, W.M.
Author_Institution :
Tech. Univ. Berlin, Germany
Abstract :
This paper describes the modular concept of a Life-time Information Module (LIM) for reliability assessment and life-time estimation of electronic components. The LIM consists of a data logger and a data processing setup for computing the reliability of individual electronic products, which are subject to different use conditions. It is designed for realizing novel failure prediction and lifetime estimation methods.
Keywords :
data loggers; failure analysis; reliability; data logger; data processing; electronic component; failure analysis; life-cycle; lifetime information module; reliability; Assembly; Consumer electronics; Data analysis; Failure analysis; Life estimation; Lifetime estimation; Maintenance; North America; Reliability engineering; Testing;
Conference_Titel :
Integrated Reliability Workshop Final Report, 2002. IEEE International
Print_ISBN :
0-7803-7558-0
DOI :
10.1109/IRWS.2002.1194262