DocumentCode
3387201
Title
Using life-cycle information for reliability assessment of electronic assemblies
Author
Middendorf, A. ; Griese, H. ; Reichl, H. ; Grim, W.M.
Author_Institution
Tech. Univ. Berlin, Germany
fYear
2002
fDate
21-24 Oct. 2002
Firstpage
176
Lastpage
179
Abstract
This paper describes the modular concept of a Life-time Information Module (LIM) for reliability assessment and life-time estimation of electronic components. The LIM consists of a data logger and a data processing setup for computing the reliability of individual electronic products, which are subject to different use conditions. It is designed for realizing novel failure prediction and lifetime estimation methods.
Keywords
data loggers; failure analysis; reliability; data logger; data processing; electronic component; failure analysis; life-cycle; lifetime information module; reliability; Assembly; Consumer electronics; Data analysis; Failure analysis; Life estimation; Lifetime estimation; Maintenance; North America; Reliability engineering; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Integrated Reliability Workshop Final Report, 2002. IEEE International
Print_ISBN
0-7803-7558-0
Type
conf
DOI
10.1109/IRWS.2002.1194262
Filename
1194262
Link To Document