Title :
A systematic leakage current analysis of gate oxide soft breakdown
Author :
Reiner, Joachim C.
Author_Institution :
EMPA Dept. Electron., Metrol. Reliability Centre, Dubendorf, Switzerland
Abstract :
Soft breakdown is a breakdown mechanism observed for gate oxide layer thickness of 7 nm and less. The physical origin of this new reliability issue is still under debate. The results presented here show that most of the preand post-breakdown leakage current phenomena can be observed on the same sample. This indicates that the breakdown of a thin gate oxide is a complex process. The leakage current bursts observed before the (soft) breakdown event might be used as pre-breakdown trigger signal possibly allowing the study of the weak spot before its destruction by the breakdown event.
Keywords :
electric breakdown; leakage currents; reliability; gate oxide; leakage current; reliability; soft breakdown; CMOS technology; Degradation; Electric breakdown; Electron traps; Fluctuations; Leakage current; MOSFET circuits; Modems; Physics; Stress;
Conference_Titel :
Integrated Reliability Workshop Final Report, 2002. IEEE International
Print_ISBN :
0-7803-7558-0
DOI :
10.1109/IRWS.2002.1194267