DocumentCode :
3387566
Title :
Low ohmic-contact resistance in recessed-gate normally-off AlGaN/GaN MIS-HEMT with δ-doped GaN Cap Layer
Author :
Wakejima, A. ; Ando, A. ; Watanabe, A. ; Inoue, K. ; Kubo, T. ; Nagai, T. ; Kato, N. ; Osada, Y. ; Kamimura, R. ; Egawa, T.
Author_Institution :
Nagoya Inst. of Technol., Showa, Japan
fYear :
2015
fDate :
21-24 June 2015
Firstpage :
59
Lastpage :
60
Abstract :
Summary form only given. In this paper, we discuss an ohmic contact resistance (Rc) in a recessed-gate normally-off AlGaN/GaN MIS-HEMT with a δ-doped GaN Cap Layer. This structure ensures high uniformity of a threshold voltage (Vth) by a selective dry-etching of GaN over AlGaN at a gate region. At the δ-doped region of the GaN cap layer, diffusion of electrons toward the surface leaves excess ionized donors, resulting in compensation of negative polarization charges between the GaN cap and the AlGaN barrier. Thanks to this effect, we successfully obtained an low Rc of less than 0.1 Ωmm by reduction of band-barrier at the interface between the GaN cap and the AlGaN barrier.
Keywords :
III-V semiconductors; MIS structures; aluminium compounds; etching; gallium compounds; high electron mobility transistors; ohmic contacts; wide band gap semiconductors; AlGaN-GaN; band barrier reduction; cap layer; low ohmic contact resistance; negative polarization charge compensation; recessed gate normally-off MIS-HEMT; selective dry etching; threshold voltage uniformity; Gallium nitride; Switches;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Device Research Conference (DRC), 2015 73rd Annual
Conference_Location :
Columbus, OH
Print_ISBN :
978-1-4673-8134-5
Type :
conf
DOI :
10.1109/DRC.2015.7175553
Filename :
7175553
Link To Document :
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