DocumentCode :
3387801
Title :
3D Si-based nanochannel platform for robust cell electroporation
Author :
Bertani, P. ; Chang, L.Q. ; Gallego-Perez, D. ; Malkoc, V. ; Lee, L.J. ; Lu, W.
Author_Institution :
Dept. of Electr. & Comput. Eng., Ohio State Univ., Columbus, OH, USA
fYear :
2015
fDate :
21-24 June 2015
Firstpage :
83
Lastpage :
84
Abstract :
Electroporation is a cellular delivery method making use of a voltage pulse to propel exogenous material through the cell membrane and into the cell allowing the modification of a given cell or cell population. An ideal electroporation system would possess four characteristics encompassing the benefits of all these systems: (1) high throughput, (2) high cell viability, (3) excellent deliver efficiency, and (4) controlled dosage. Many advances1-2 in cell electroporation allow for high throughput, high cell viability, or excellent dosage control, yet no platform is available for the combination of all three. In this work, we show a “3D nanochannel electroporation (NEP) system” (Fig. 1a) on a silicon-chip platform designed to meet these three criteria. This “NEP chip” is patterned on one side using a ~500 nm circle array and the other using a 50 μm array. Each pattern is then etched through until connection is established as shown in Fig. 1b. The etching of the 3D NEP chip is done using the Bosch process, a combination of SF6 and C4F8 plasma chemistries giving a highly directional etch for creation of high aspect ratio features. The result is a 3D nanochannel array consisting of nanopores that are ~500 nm in diameter and 20-25 μm deep. The backside microchannel array consists of wells that are 50 μm in diameter and ~225-230 μm deep.
Keywords :
biomembranes; cellular biophysics; elemental semiconductors; etching; nanoelectronics; plasma chemistry; semiconductor devices; silicon; 3D NEP chip; 3D Si-based nanochannel platform; 3D nanochannel array; 3D nanochannel electroporation system; Bosch process; Si; cell membrane; cell population; cellular delivery method; depth 20 mum to 25 mum; exogenous material; high aspect ratio features; high cell viability; highly directional etching; nanopores; plasma chemistry; robust cell electroporation system; silicon-chip platform; size 50 mum; voltage pulse; Propulsion; Reliability; Three-dimensional displays;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Device Research Conference (DRC), 2015 73rd Annual
Conference_Location :
Columbus, OH
Print_ISBN :
978-1-4673-8134-5
Type :
conf
DOI :
10.1109/DRC.2015.7175566
Filename :
7175566
Link To Document :
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