• DocumentCode
    3387904
  • Title

    Scalability of weak consistency in NoC based multicore architectures

  • Author

    Naeem, Abdul ; Chen, Xiaowen ; Lu, Zhonghai ; Jantsch, Axel

  • Author_Institution
    Dept. of Electron. Syst., R. Inst. of Technol., Stockholm, Sweden
  • fYear
    2010
  • fDate
    May 30 2010-June 2 2010
  • Firstpage
    3497
  • Lastpage
    3500
  • Abstract
    In Multicore Network-on-Chip, it is preferable to realize distributed but shared memory (DSM) in order to reuse the huge amount of legacy code and easy programming. Within DSM systems, memory consistency is a critical issue since it affects not only performance but also the correctness of programs. In this paper, we investigate the scalability of the weak consistency model, which may be implemented using a transaction counter. The experimental results compare synchronization latencies for various network sizes, topologies and lock positions in the network. Average synchronization latency rises exponentially for mesh and torus topologies as the network size grows. However, torus improves the synchronization latency in comparison to mesh. For mesh topology network average synchronization latency is also slightly affected by the lock position with respect to the network center.
  • Keywords
    distributed shared memory systems; multiprocessor interconnection networks; network-on-chip; parallel architectures; performance evaluation; synchronisation; transaction processing; NoC; consistency scalability; distributed shared memory; lock position; mesh topology; multicore architecture; network-on-chip; synchronization latency; torus topology; transaction counter; Communications technology; Computer architecture; Counting circuits; Delay; Microelectronics; Microprocessors; Multicore processing; Network topology; Network-on-a-chip; Scalability; Distributed shared memory; Memory consistency; Scalability; Synchronization;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Circuits and Systems (ISCAS), Proceedings of 2010 IEEE International Symposium on
  • Conference_Location
    Paris
  • Print_ISBN
    978-1-4244-5308-5
  • Electronic_ISBN
    978-1-4244-5309-2
  • Type

    conf

  • DOI
    10.1109/ISCAS.2010.5537833
  • Filename
    5537833