DocumentCode
3388153
Title
Defect screening using independent component analysis on IDDQ
Author
Turakhia, Ritech ; Benware, Brady ; Madge, Robert ; Shannon, Thaddeus ; Daasch, Robert
Author_Institution
ICDT Lab., Portland State Univ., OR, USA
fYear
2005
fDate
1-5 May 2005
Firstpage
427
Lastpage
432
Abstract
An IDDQ Statistical Post-Processing™ (SPP) outlier screen is presented based on the computation of statistically independent sources of variation in the IDDQ measurements. IDDQ measurements from die passing all other tests are modeled using sources of variation extracted by independent component analysis (ICA). Outliers are separated from the sample population based on residuals computed using these sources and a nearest neighbor spatial signature. An algorithm is presented for applying the proposed technique in production. The screen is demonstrated with 0.18μm and 0.11μm volume data and shown to effectively identify the outliers at the 0.1 μm technology node.
Keywords
electric current measurement; independent component analysis; integrated circuit measurement; integrated circuit testing; semiconductor process modelling; 0.1 micron; 0.11 micron; 0.18 micron; IDDQ Statistical Post-Processing; IDDQ measurements; defect screening; independent component analysis; nearest neighbor spatial signature; Application specific integrated circuits; Current measurement; Distributed computing; Independent component analysis; Integrated circuit modeling; Large scale integration; Logic; Nearest neighbor searches; Predictive models; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
VLSI Test Symposium, 2005. Proceedings. 23rd IEEE
ISSN
1093-0167
Print_ISBN
0-7695-2314-5
Type
conf
DOI
10.1109/VTS.2005.38
Filename
1443460
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