Title :
Nineteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.03CH37437)
Abstract :
The following topics are dealt with: CFD modeling of electronic systems; advances in cooling techniques; heat pipes in electronic systems; temperature measurement techniques; thermal interface materials - measurement techniques and standards; dynamic compact models; optical measurement techniques; compact thermal models; temperature effects on performance and reliability; cooling in challenging environments.
Keywords :
computational fluid dynamics; cooling; heat pipes; integrated circuit modelling; integrated circuit packaging; integrated circuit reliability; measurement standards; semiconductor device models; semiconductor device packaging; semiconductor device reliability; temperature measurement; thermal analysis; thermal management (packaging); challenging environment cooling; compact thermal models; cooling techniques; dynamic compact models; electronic system CFD modeling; heat pipes; measurement standards; optical measurement techniques; performance temperature effects; reliability temperature effects; semiconductor thermal measurement; temperature measurement techniques; thermal interface materials; thermal management;
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium, 2003. Ninteenth Annual IEEE
Conference_Location :
San Jose, CA, USA
Print_ISBN :
0-7803-7793-1
DOI :
10.1109/STHERM.2003.1194331
