Flow modeling in air-cooled electronic enclosures

Author

Baelmans, Martine ; Meyers, J. ; Nevelsteen, K.

Author_Institution

Dept. of Mech. Eng., Katholieke Univ., Leuven, Belgium

fYear

2003

fDate

11-13 March 2003

Firstpage

27

Lastpage

34

Abstract

Computational fluid dynamics (CFD) has indisputably become a very useful tool in the early design phase of electronics systems. Its success, however, does not guarantee accurate predictions in all situations. Therefore, this paper focuses on typical, but complex, flow features where the predictive capability of CFD is still rather poor. Examples are given for enclosures with forced convection cooling. Different aspects of system level modeling are analyzed: fan modeling and induced swirling flow, pressure loads and friction forces induced by screens and flow aspects in between printed circuit boards (PCBs) or more specifically around in line positioned electronic components. All numerical results are thereby compared to experimental data.

Keywords

computational fluid dynamics; cooling; flow simulation; forced convection; swirling flow; thermal management (packaging); CFD design tool; CFD predictive capability; air-cooled electronic enclosures; complex flow modeling; computational fluid dynamics; fan modeling; flow features; forced convection cooling; in-line positioned electronic components; induced swirling flow; inter-PCB flow aspects; prediction accuracy; pressure loads; screen induced friction forces; Computational fluid dynamics; Computational modeling; Electromagnetic compatibility; Electronics cooling; Fans; Filters; Mechanical engineering; Printed circuits; Temperature; Vents;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Thermal Measurement and Management Symposium, 2003. Ninteenth Annual IEEE

ISSN

1065-2221

Print_ISBN

0-7803-7793-1

Type

conf

DOI

10.1109/STHERM.2003.1194335

Filename

1194335