Development of a high performance heat sink based on screen-fin technology

Author

Li, Chen ; Wirtz, R.A.

Author_Institution

Mech. Eng. Dept., Nevada Univ., Reno, NV, USA

fYear

2003

fDate

11-13 March 2003

Firstpage

53

Lastpage

60

Abstract

In this paper, we describe a novel high-performance heat sink based on screen-fin technology. The structural features of the heat sink are presented. The apparatus to measure both the pressure drop and heat transfer performance is described. Correlation equations of friction factor and Colburn-j factor as a function of the divergence half angle θ, coolant properties and flow rate through the mesh are formulated. A semiempirical model is used to predict the heat exchanger pressure drop, thermal performance and to design prototype heat sinks. Prototypes are built and tested. By screen-fin technology, the best performance of this kind of heat sink with external dimensions: 76.2 mm wide, 63.5 mm deep with 38.1 mm high screen-laminate fins is 4.3 Watt/°C at 62.3 Pa pressure drop of air flow through the heat sink.

Keywords

heat exchangers; heat sinks; laminates; thermal management (packaging); 38.1 mm; 63.5 mm; 76.2 mm; coolant properties; divergence half angle; friction/Colburn-j factor correlation equations; heat exchanger pressure drop; heat transfer performance; high performance heat sink; screen-fin technology; screen-laminate fins; through mesh flow rate; Cooling; Costs; Electronic packaging thermal management; Flexible manufacturing systems; Friction; Heat sinks; Heat transfer; Prototypes; Thermal conductivity; Thermal factors;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Thermal Measurement and Management Symposium, 2003. Ninteenth Annual IEEE

ISSN

1065-2221

Print_ISBN

0-7803-7793-1

Type

conf

DOI

10.1109/STHERM.2003.1194339

Filename

1194339