DocumentCode :
3388793
Title :
Logic-compatible embedded DRAM design for memory intensive low power systems
Author :
Chun, Ki Chul ; Jain, Pulkit ; Kim, Chris H.
Author_Institution :
Dept. of Electr. & Comput. Eng., Univ. of Minnesota, Minneapolis, MN, USA
fYear :
2010
fDate :
May 30 2010-June 2 2010
Firstpage :
277
Lastpage :
280
Abstract :
Circuit techniques for enabling a low power logic-compatible embedded DRAM (eDRAM) are presented. A boosted 3T gain cell utilizes preferential storage node boosting to improve data retention time and increase read margin. A regulated bit-line write scheme is equipped with a steady-state storage node voltage monitor to overcome the data `1´ write disturbance problem. An adaptive and die-to-die adjustable read reference bias generator is proposed to cope with PVT variations. Measurement data from 65nm test chips demonstrate a >1.0msec retention time at 0.9V, 85°C and a <;100μW per Mb refresh power at 1.0V, 85°C which translates into a 50% reduction in static power compared to a power gated SRAM.
Keywords :
DRAM chips; boosted 3T gain cell; circuit technique; data 1 write disturbance problem; data retention time; die-to-die adjustable read reference bias generator; logic-compatible embedded DRAM design; memory intensive low power system; preferential storage node boosting; read margin; regulated bit-line write scheme; size 65 nm; steady-state storage node voltage monitor; temperature 85 C; voltage 0.9 V; voltage 1 V; Boosting; Circuits; Monitoring; Power measurement; Power systems; Random access memory; Semiconductor device measurement; Steady-state; Time measurement; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Circuits and Systems (ISCAS), Proceedings of 2010 IEEE International Symposium on
Conference_Location :
Paris
Print_ISBN :
978-1-4244-5308-5
Electronic_ISBN :
978-1-4244-5309-2
Type :
conf
DOI :
10.1109/ISCAS.2010.5537877
Filename :
5537877
Link To Document :
بازگشت