DocumentCode
338887
Title
Advances in power electronic devices
Author
Wolfgang, Eckhard ; Niedernostheide, F.-J. ; Reznik, Daniel ; Schulze, Hans-Joachim
Author_Institution
Corp. Technol., Siemens AG, Munich, Germany
fYear
1999
fDate
36281
Firstpage
4
Lastpage
8
Abstract
The development of new silicon-based power devices will remain important for decades to come thanks to many significant applications. Silicon power semiconductors (thyristors, IGBTs, CoolMOSTM) will benefit immediately from advances in silicon microelectronics. These include: an improved understanding of and greater precision in individual fabrication processes; a continued reduction in defect density; larger wafer diameters; and a wide diversity of topologies, e.g., in trench IGBTs. These developments lead to ongoing improvements in quality and reliability and a continuous reduction in the cost of chip manufacture
Keywords
elemental semiconductors; insulated gate bipolar transistors; power MOSFET; power bipolar transistors; silicon; thyristors; CoolMOSTM; IGBTs; Si; chip manufacture cost reduction; defect density reduction; fabrication processes; power electronic device advances; quality; reliability; silicon microelectronics; silicon-based power semiconductors; thyristors; topologies diversity; trench IGBTs; wafer diameter; Frequency; Insulated gate bipolar transistors; MOSFETs; Power semiconductor switches; Protection; Silicon carbide; Space technology; Testing; Thyristors; Voltage control;
fLanguage
English
Publisher
ieee
Conference_Titel
Electric Machines and Drives, 1999. International Conference IEMD '99
Conference_Location
Seattle, WA
Print_ISBN
0-7803-5293-9
Type
conf
DOI
10.1109/IEMDC.1999.768670
Filename
768670
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