Measurement, significance and application of thermal properties of thermal interface materials using ASTM D5470

Author

Bunyan, Michael H. ; de Sorgo, Miksa

Author_Institution

Chomerics Div., Parker Hannifin Corp, Woburn, MA, USA

fYear

2003

fDate

11-13 March 2003

Firstpage

119

Lastpage

122

Abstract

This paper describes the ASTM D5470 (1) test method for measuring thermal transmission properties of interface materials. Details of the equipment, the methodology and the care required for accurate power and temperature measurements are discussed. The difference between a material property as determined by D5470, and an application specific property as measured under actual in-situ conditions are discussed in detail. The paper concludes by showing examples of how a thermal property determined by D5470 can be used to obtain first order approximation of performance in a specific application.

Keywords

materials testing; measurement standards; thermal conductivity measurement; thermal resistance measurement; ASTM D5470 (1) test method; application specific property; material thermal transmission properties; measurement standards; power measurements; temperature measurements; thermal conductivity measurement; thermal interface materials properties measurement; thermal resistance measurement; Aluminum; Conducting materials; Contact resistance; Electrical resistance measurement; Materials testing; Resistance heating; System testing; Temperature measurement; Thermal conductivity; Thermal resistance;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Thermal Measurement and Management Symposium, 2003. Ninteenth Annual IEEE

ISSN

1065-2221

Print_ISBN

0-7803-7793-1

Type

conf

DOI

10.1109/STHERM.2003.1194348

Filename

1194348