Lumped capacity thermal circuit diagram of active chip cooling schemes

Author

Sabounchi, Poorya ; Heydari, Ah

Author_Institution

California Univ., Berkeley, CA, USA

fYear

2003

fDate

11-13 March 2003

Firstpage

151

Lastpage

155

Abstract

There is a strong need to improve our current capabilities in thermal management and electronic cooling, since estimates indicate that IC power density level could reach 50 W/cm in the near future. This paper presents an innovative approach for thermal modeling of active cooling schemes. It is shown that the principles of energy conversion can be used to overcome the problems of thermal resistance narrowing. Cooling schemes such as mesoscale vapor compression refrigeration, liquid cooling, thermoelectric microcoolers and microchannel heatsinks are discussed and compared relative to heat dissipation potential.

Keywords

cooling; heat sinks; integrated circuit modelling; integrated circuit packaging; refrigeration; thermal analysis; thermal management (packaging); thermal resistance; thermoelectric devices; IC power density level; active chip cooling schemes; electronic cooling schemes; energy conversion; heat dissipation potential; liquid cooling; lumped capacity thermal circuit diagram; mesoscale vapor compression refrigeration; microchannel heatsinks; thermal management; thermal modeling; thermal resistance narrowing; thermoelectric microcoolers; Circuits; Electronics cooling; Energy conversion; Energy management; Liquid cooling; Refrigeration; Thermal management; Thermal management of electronics; Thermal resistance; Thermoelectricity;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Thermal Measurement and Management Symposium, 2003. Ninteenth Annual IEEE

ISSN

1065-2221

Print_ISBN

0-7803-7793-1

Type

conf

DOI

10.1109/STHERM.2003.1194354

Filename

1194354