DocumentCode :
3389089
Title :
Experimental and numerical simulation study of heat sinks with impingement flow at high Reynolds numbers
Author :
Reddy, A. Venugopal
Author_Institution :
Intel Corp., Folsom, CA, USA
fYear :
2003
fDate :
11-13 March 2003
Firstpage :
176
Lastpage :
178
Abstract :
The heat transfer in confined air jet cooling for electronic cooling applications is studied experimentally and through simulations. Copper and aluminum heat sinks are studied at various air-flow rates. The case to ambient thermal resistance of the copper heat sink varied from 0.38-0.23°C/W (the Reynolds number varied from 45,000-105,000). The simulations predicted a higher thermal resistance, however the predicted resistance trend matched the experimental trend. The experimental thermal resistance of the aluminum heat sink varied from 0.48-0.34°C/W (the Reynolds number varied from 45,000-90,000). The resistance trend for both the copper and aluminum heat sinks indicates that the reduction in thermal resistance would be minimal with further increase in flow rate. Simulation results show that these heat sinks can be further optimized by varying the number and spacing of the pin fins.
Keywords :
aluminium; confined flow; cooling; copper; heat sinks; jets; optimisation; thermal resistance; Al; Cu; air-flow rate; aluminum heat sinks; confined air jet cooling; copper heat sinks; electronic cooling; heat sink optimization; heat transfer; high Reynolds number impingement flow; pin fins number/spacing; thermal resistance; Aluminum; Copper; Electronics cooling; Heat sinks; Heat transfer; Numerical simulation; Orifices; Resistance heating; Temperature; Thermal resistance;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium, 2003. Ninteenth Annual IEEE
ISSN :
1065-2221
Print_ISBN :
0-7803-7793-1
Type :
conf
DOI :
10.1109/STHERM.2003.1194358
Filename :
1194358
Link To Document :
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