• DocumentCode
    3389240
  • Title

    An effective methodology for mixed scan and reset design based on test generation and structure of sequential circuits

  • Author

    Liang, Hsing-Chung ; Lee, Chung Len

  • Author_Institution
    Dept. of Electron. Eng., Chang Gung Univ., Tao-Yuan, Taiwan
  • fYear
    1999
  • fDate
    1999
  • Firstpage
    173
  • Lastpage
    178
  • Abstract
    In this paper, a flip-flop selection methodology, which utilizes reachable states of flip-flops, required states for hard-to-detect faults, which are obtained from test generation, and the structural connection relationship of flip-flops, to achieve a nearly optimal mixed partial-scan/reset design, is proposed. The methodology first generates and simulates test patterns for the circuit-under-test to obtain information of reachable states and states needed for excitation and propagation of hard-to-detect faults. It then searches the connection relationship among flip-flops and arranges flip-flops in an appropriate order for mixed partial scan and reset selection. Experimental results show that the method achieves higher testability than reported methods with a lesser number of scan/reset flip-flops
  • Keywords
    automatic test pattern generation; boundary scan testing; design for testability; fault diagnosis; flip-flops; integrated circuit testing; logic simulation; logic testing; sequential circuits; DFT; circuit-under-test; flip-flop selection methodology; hard-to-detect faults; mixed partial scan; mixed partial-scan/reset design; reachable states; required states; reset selection; sequential circuits; structural connection relationship; test generation; test pattern simulation; testability; Circuit faults; Circuit testing; Controllability; Design for testability; Electronic equipment testing; Fault detection; Flip-flops; Hardware; Sequential analysis; Sequential circuits;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Test Symposium, 1999. (ATS '99) Proceedings. Eighth Asian
  • Conference_Location
    Shanghai
  • ISSN
    1081-7735
  • Print_ISBN
    0-7695-0315-2
  • Type

    conf

  • DOI
    10.1109/ATS.1999.810747
  • Filename
    810747