DocumentCode :
3389331
Title :
Non-linearity issues in the dynamic compact model generation [package thermal modeling]
Author :
Rencz, Marta ; Szekely, Vladimir
Author_Institution :
MicReD Ltd., Budapest, Hungary
fYear :
2003
fDate :
11-13 March 2003
Firstpage :
263
Lastpage :
270
Abstract :
The dynamic compact thermal Rth-Cth (RC) models of packages generated from the transient measurements or simulations are usually temperature independent, that is linear. This is theoretically erroneous. In this paper we show how to generate nonlinear compact thermal models. Algorithms with which network simulators can simulate nonlinear Rth and Cth elements are also given. With the help of the generated correct nonlinear models of packages, we present various experiments in which the order of magnitude of the error, caused by neglecting the temperature dependence of the Rth and Cth elements of the dynamic compact thermal models is checked.
Keywords :
RC circuits; nonlinear network analysis; thermal analysis; thermal management (packaging); dynamic compact thermal model generation; electrical RC elements; nonlinear element network simulators; package thermal behavior; package thermal modeling; temperature dependence; thermal model nonlinearities; Circuit simulation; Conducting materials; Electronic packaging thermal management; Error correction; Linearity; Nonlinear circuits; Temperature dependence; Temperature distribution; Temperature sensors; Thermal conductivity;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium, 2003. Ninteenth Annual IEEE
ISSN :
1065-2221
Print_ISBN :
0-7803-7793-1
Type :
conf
DOI :
10.1109/STHERM.2003.1194372
Filename :
1194372
Link To Document :
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