Title :
A comparative study of two simulation methods for thermal analysis of power electronic devices
Author :
Napieralski, Andrzej ; Skorek, Adam ; Dorkel, Jean-Marie
Author_Institution :
Lab. d´´Autom. et d´´Analyse des Syst., CNRS, Toulouse, France
Abstract :
The authors compare two methods applied to 3D temperature map computation of power hybrid circuits. The first is the conventional FE method, and the second, so-called thermal influence coefficient method (TIC), is a specific procedure devised for fast temperature computations of hybrid power circuits. The numerical methods designed for true 3D thermal analyses have been implemented in programs running on PC-AT microcomputers.
Keywords :
circuit analysis computing; digital simulation; finite element analysis; microcomputer applications; power electronics; semiconductor device models; temperature distribution; thermal analysis; 3D temperature map; FEM; PC-AT microcomputers; circuit analysis computing; digital simulation; numerical methods; power electronic devices; power hybrid circuits; semiconductor device models; thermal analysis; thermal influence coefficient method; Analytical models; Circuit simulation; Computational modeling; Data processing; Design methodology; Displays; Iron; Optical computing; Packaging; Process design;
Conference_Titel :
Computers in Power Electronics, 1992., IEEE Workshop on
Conference_Location :
Berkeley, CA, USA
Print_ISBN :
0-7803-0920-0
DOI :
10.1109/CIPE.1992.247285
