• DocumentCode
    3389372
  • Title

    Transient thermal modeling of high-power pulsed laser diode arrays

  • Author

    Carter, Jason ; Snyder, David ; Reichenbaugh, Jerry

  • Author_Institution
    Appl. Res. Lab., Pennsylvania State Univ., Kittanning, PA, USA
  • fYear
    2003
  • fDate
    11-13 March 2003
  • Firstpage
    276
  • Lastpage
    283
  • Abstract
    Laser diode arrays are a high thermal flux electro-optic application where performance and reliability are a strong function of operating temperature. An understanding of the movement of heat in arrays and the effect of material choices on thermal performance are critical to optimum design of arrays. A modeling tool and accompanying methodology are outlined. Simulated diode array performance under a wide array of conditions and can be used to simulate tests that are difficult or cost-prohibitive. Through the development process, models of full 10-bar arrays were found to be accurate in modeling steady state or quasi-steady state performance but insufficient for microsecond transient responses. Initial efforts to incorporate small-scale laser diode properties into a large scale device model are described.
  • Keywords
    heat sinks; semiconductor device measurement; semiconductor device models; semiconductor laser arrays; thermal management (packaging); thermal resistance; transient response; LDA operating temperature; heat sink; high thermal flux electro-optic application; high-power pulsed laser diode arrays; quasi-steady state performance; steady state performance; thermal performance; thermal resistance; transient response; transient thermal modeling; Assembly; Diode lasers; Linear discriminant analysis; Numerical models; Optical arrays; Optical design; Optical pulses; Optical pumping; Semiconductor laser arrays; Surface emitting lasers;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Thermal Measurement and Management Symposium, 2003. Ninteenth Annual IEEE
  • ISSN
    1065-2221
  • Print_ISBN
    0-7803-7793-1
  • Type

    conf

  • DOI
    10.1109/STHERM.2003.1194374
  • Filename
    1194374