Title :
Recent progress in compact thermal models
Author :
Lasance, Clemens J M
Author_Institution :
Philips Res. Labs., Eindhoven, Netherlands
Abstract :
The paper presents a number of recent developments in compact thermal modelling. A substantial part is devoted to a discussion on the accuracy of boundary-condition-independent (BCI) compact thermal models (CTMs) in practical situations. It has been repeatedly shown that high accuracy can be obtained when comparing CTMs to detailed model results. However, these results are usually generated using certain assumptions. The validity of these assumptions is the main subject of this paper. An important conclusion is that the ´traditionally´ generated CTMs perform very well in ´real-life´ environments. Other recent developments that are shortly reviewed are: progress in dynamic compact modelling, the possibility of parameterisation, experimental calibration, and standardisation of CTMs.
Keywords :
ball grid arrays; computational fluid dynamics; heat sinks; heat transfer; integrated circuit modelling; semiconductor device models; temperature distribution; thermal analysis; thermal management (packaging); BGA structure; CFD; CTM accuracy; CTM standardisation; boundary-condition-independent compact thermal models; computational fluid dynamics; dynamic compact modelling; experimental calibration; heat sink; heat transfer; parameterisation; temperature distribution; Boundary conditions; Calibration; Computational fluid dynamics; Extrapolation; Heat transfer; Laboratories; Packaging; Predictive models; Temperature; Thermal conductivity;
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium, 2003. Ninteenth Annual IEEE
Print_ISBN :
0-7803-7793-1
DOI :
10.1109/STHERM.2003.1194376
