• DocumentCode
    3389530
  • Title

    A low-noise high-sensitivity readout circuit for MEMS capacitive sensors

  • Author

    Shiah, Jack ; Rashtian, Hooman ; Mirabbasi, Shahriar

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Univ. of British Columbia, Vancouver, BC, Canada
  • fYear
    2010
  • fDate
    May 30 2010-June 2 2010
  • Firstpage
    3280
  • Lastpage
    3283
  • Abstract
    This paper presents a differential low-noise high-resolution switched-capacitor readout circuit that is intended for capacitive sensors. Amplitude modulation/demodulation and correlated double sampling are used to minimize the adverse effects of the amplifier offset and flicker (1/f) noise and improve the sensitivity of the readout circuit. In order to simulate the response of the readout circuit, a Verilog-A model is used to model the variable sense capacitor. The interface circuit is designed and laid out in a 0.8 μm CMOS process. Post-layout simulation results show that the readout interface is able to linearly resolve sense capacitance variation from 2.8 aF to 0.3 fF with a sensitivity of 7.88 mV/aF from a single 5V supply (the capacitance-to-voltage conversion is approximately linear for capacitance changes from 0.3 fF to ~1.2 fF). The power consumption of the circuit is 9.38 mW.
  • Keywords
    CMOS integrated circuits; amplitude modulation; capacitive sensors; flicker noise; micromechanical devices; readout electronics; switched capacitor networks; MEMS capacitive sensor; Verilog-A model; amplifier offset; amplitude demodulation; amplitude modulation; flicker noise; power 9.38 mW; power consumption; size 0.8 mum; switched capacitor readout circuit; variable sense capacitor; voltage 5 V; Amplitude modulation; Capacitance; Capacitive sensors; Circuit noise; Circuit simulation; Demodulation; Micromechanical devices; Sampling methods; Semiconductor device modeling; Switching circuits;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Circuits and Systems (ISCAS), Proceedings of 2010 IEEE International Symposium on
  • Conference_Location
    Paris
  • Print_ISBN
    978-1-4244-5308-5
  • Electronic_ISBN
    978-1-4244-5309-2
  • Type

    conf

  • DOI
    10.1109/ISCAS.2010.5537915
  • Filename
    5537915