• DocumentCode
    3389796
  • Title

    Super-resolution technique for thermography with dual-camera system

  • Author

    Chikamatsu, Shingo ; Nakaya, Tomohiro ; Kouda, Masakazu ; Kuroki, Nobutaka ; Hirose, Tetsuya ; Numa, Masahiro

  • Author_Institution
    Grad. Sch. of Eng., Kobe Univ., Kobe, Japan
  • fYear
    2010
  • fDate
    May 30 2010-June 2 2010
  • Firstpage
    1895
  • Lastpage
    1898
  • Abstract
    We propose the use of a super-resolution (SR) technique for thermographies. This system captures several thermal images for a reconstruction-based SR. However, it does not require the subpixel registration required by conventional SRs. In this system, a pair of a low-resolution thermal image and a high-resolution visible image is captured synchronously. While the thermal images are used as source data for SR, the visible images are used for pixel registrations. Because the resolution of the visible images from CCD sensors is over 4 times higher than that of the thermal images, a simple pixel registration on the former is equivalent to a precise subpixel registration on the latter. Thus, we can reconstruct a high quality thermogram, without the need for a complex subpixel registration technique. Experimental results demonstrate that a pair of a thermographic camera with only 8×8 pixels and a visible CCD camera with 320 × 240 pixels generates a thermogram with 32 × 32 pixels. This fact means that a pair of a low cost thermographic camera and a standard CCD camera provides high-quality thermography.
  • Keywords
    CCD image sensors; infrared imaging; CCD camera; CCD sensor; dual camera system; pixel registration; subpixel registration; super resolution technique; thermal image; thermographic camera; visible image; CMOS image sensors; Cameras; Charge coupled devices; Charge-coupled image sensors; Costs; Image reconstruction; Image resolution; Pixel; Strontium; Thermal sensors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Circuits and Systems (ISCAS), Proceedings of 2010 IEEE International Symposium on
  • Conference_Location
    Paris
  • Print_ISBN
    978-1-4244-5308-5
  • Electronic_ISBN
    978-1-4244-5309-2
  • Type

    conf

  • DOI
    10.1109/ISCAS.2010.5537929
  • Filename
    5537929