DocumentCode :
3389919
Title :
Diffuse discharges of multi-needle-plane gaps sustained by repetitive nanosecond pulses at atmospheric pressure
Author :
Hao Ma ; Cheng Zhang ; Tao Shao ; Tarasenko, Victor F. ; Ping Yan ; Weimin Huang
Author_Institution :
Inst. of Electr. Eng., Beijing, China
fYear :
2013
fDate :
20-23 Oct. 2013
Firstpage :
626
Lastpage :
629
Abstract :
In this paper, diffuse discharges sustained by nanosecond pulses are obtained in air gaps with a multi-needle-to-plane discharge electrode configuration at atmospheric pressure. A repetitive nanosecond generator with a rise time of 70ns and a full width at half maximum of 100ns is employed to drive diffuse discharges. Characteristics of the diffuse discharge were investigated by analyzing voltage-current waveforms and discharge images. Experimental results showed that a large-area diffuse discharge could be obtained with a pulse repetition frequency of up to 1 kHz. Furthermore, as the applied voltage increased, discharges transformed from corona discharge to diffuse mode, meanwhile the discharge current changed rapidly. It was also found that the discharge intensity varied according to the position of the needles; and discharge intensity in the center was weaker than that near the margin. In addition, the composition of the measured discharge current was calculated and analyzed.
Keywords :
atmospheric pressure; corona; pulse generators; air gaps; atmospheric pressure; corona discharge; diffuse discharges; discharge current; multineedle-plane gaps; multineedle-to-plane discharge electrode configuration; repetitive nanosecond generator; repetitive nanosecond pulses; time 100 ns; time 70 ns; voltage-current waveforms; Corona; Current measurement; Discharges (electric); Electrodes; Integrated circuits; Needles; Plasmas; atmospheric pressure; diffuse discharge; multi-needle; nanosecond; repetitive pulse;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Insulation and Dielectric Phenomena (CEIDP), 2013 IEEE Conference on
Conference_Location :
Shenzhen
Type :
conf
DOI :
10.1109/CEIDP.2013.6748200
Filename :
6748200
Link To Document :
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