• DocumentCode
    3390087
  • Title

    The extra-resonances of metamaterials in terahertz

  • Author

    Xie, Yunsong ; Zhang, Huaiwu ; Wen, Qiye ; Liu, Yingli ; Li, Yuanxun ; Guan, Jian

  • Author_Institution
    State Key Lab. of Electron. Thin Film & Integrated Devices, Univ. of Electron. Sci. & Technol. of China, Chengdu
  • fYear
    2008
  • fDate
    10-12 Oct. 2008
  • Firstpage
    426
  • Lastpage
    429
  • Abstract
    Some new resonances (extra-resonances) are observed in the simulations of metamaterials in terahertz band. Utilizing the parameter energy balance, the existence of the extra-resonance has been proved. The extra-resonance is found can be affected by the structure of metamaterials and the thickness of the slab. An improved LC model with the consideration of the substrate slab is presented for metamaterials. The causing of the extra-resonances is thought to the self-interaction of the electromagnetic wave, which is produced by the metal structures of the metamaterials and it is the slab that provide the place for this self-interaction. At last the reason why there is no observation of the extra-interaction in the past simulations and experiments is considered to be many of the simulations using a thin slab, as in experiments the exciting sources in the experiments is quite different from the ones in simulations.
  • Keywords
    metamaterials; millimetre wave materials; electromagnetic wave; improved LC model; metamaterial extra-resonances; terahertz band; Conducting materials; Electromagnetic radiation; Electromagnetic scattering; Metamaterials; Permeability; Permittivity; Resonance; Resonant frequency; Slabs; Wire; metamaterials; resonance; simulation; terahertz;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    System Simulation and Scientific Computing, 2008. ICSC 2008. Asia Simulation Conference - 7th International Conference on
  • Conference_Location
    Beijing
  • Print_ISBN
    978-1-4244-1786-5
  • Electronic_ISBN
    978-1-4244-1787-2
  • Type

    conf

  • DOI
    10.1109/ASC-ICSC.2008.4675398
  • Filename
    4675398