DocumentCode :
3390166
Title :
Insulation condition diagnosis of transformer with multi-peak polarization spectrum
Author :
Zhang Tao ; Li Xiaoqin ; Ma Feilin ; Sun Liuxue
Author_Institution :
Coll. of Electr. Eng. & New Energy, China Three Gorges Univ., Yichang, China
fYear :
2013
fDate :
20-23 Oct. 2013
Firstpage :
567
Lastpage :
570
Abstract :
Return voltage measurement is an effective dielectric response test method and has been used to evaluate aging condition of solid insulation. The dominant time constant is one of the most common characteristic quantities for assessing the moisture of the transformer. However, the return voltage curve maybe appear multiple peaks due to many factors in the process of field test, which affects the accurate judgment of the dominant time constant, therefore, it is difficult to evaluate transformer solid insulation condition by polarization spectrum and the dominant time constant. This paper analyzes the relationship between the return voltage characteristics and parameters of the equivalent circuit based on extended Debye model to better understand the variation rule of the polarization spectrum. According to the simulation results, some new ideas of diagnosing solid insulation condition are proposed. The results show that the method proposed in this paper is reasonable and effective.
Keywords :
dielectric polarisation; equivalent circuits; insulation testing; paper; power transformer insulation; voltage measurement; aging condition; dielectric response test method; dominant time constant; equivalent circuit; extended Debye model; multipeak polarization spectrum; return voltage measurement; transformer insulation condition diagnosis; transformer moisture assessment; transformer solid insulation condition; Dielectrics; Moisture; Oil insulation; Polarization; Power transformer insulation; Insulation paper; Return Voltage; multiple peaks; polarization spectrum;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Insulation and Dielectric Phenomena (CEIDP), 2013 IEEE Conference on
Conference_Location :
Shenzhen
Type :
conf
DOI :
10.1109/CEIDP.2013.6748214
Filename :
6748214
Link To Document :
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