DocumentCode
3390338
Title
Characterisation of silicon oxynitrides and high-k dielectric materials by angle-resolved X-ray photoelectron spectroscopy
Author
Mack, P. ; White, R. ; Wolstenholme, J. ; Wright, A.
Author_Institution
Thermo VG Sci., East Grinstead, UK
fYear
2003
fDate
31 March-1 April 2003
Firstpage
154
Lastpage
159
Abstract
Angle-resolved X-ray photoelectron spectroscopy (ARXPS) has been used to characterise nondestructively silicon oxynitride and high-k film samples. Film thickness values and concentration profiles were determined in each case. Different chemical states of nitrogen were identified in the silicon oxynitride sample and concentration profiles and dose values for each nitrogen state were calculated. ARXPS was also used to study the difference between hafnium oxide films deposited on thermally grown silicon oxide and on HF-etched silicon. The thickness and chemistry of the interfacial layers were characterised.
Keywords
X-ray photoelectron spectra; dielectric thin films; hafnium compounds; silicon compounds; HF-etched silicon; HfO2; SiON; angle-resolved X-ray photoelectron spectroscopy; concentration profile; hafnium oxide film; high-K dielectric material; interfacial layer; silicon oxynitride film; thermally grown silicon oxide; Chemicals; Dielectric materials; Electrochemical impedance spectroscopy; High K dielectric materials; High-K gate dielectrics; Nitrogen; Pollution measurement; Semiconductor films; Silicon; Thickness measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Semiconductor Manufacturing Conference and Workshop, 2003 IEEEI/SEMI
ISSN
1078-8743
Print_ISBN
0-7803-7681-1
Type
conf
DOI
10.1109/ASMC.2003.1194486
Filename
1194486
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