• DocumentCode
    3390338
  • Title

    Characterisation of silicon oxynitrides and high-k dielectric materials by angle-resolved X-ray photoelectron spectroscopy

  • Author

    Mack, P. ; White, R. ; Wolstenholme, J. ; Wright, A.

  • Author_Institution
    Thermo VG Sci., East Grinstead, UK
  • fYear
    2003
  • fDate
    31 March-1 April 2003
  • Firstpage
    154
  • Lastpage
    159
  • Abstract
    Angle-resolved X-ray photoelectron spectroscopy (ARXPS) has been used to characterise nondestructively silicon oxynitride and high-k film samples. Film thickness values and concentration profiles were determined in each case. Different chemical states of nitrogen were identified in the silicon oxynitride sample and concentration profiles and dose values for each nitrogen state were calculated. ARXPS was also used to study the difference between hafnium oxide films deposited on thermally grown silicon oxide and on HF-etched silicon. The thickness and chemistry of the interfacial layers were characterised.
  • Keywords
    X-ray photoelectron spectra; dielectric thin films; hafnium compounds; silicon compounds; HF-etched silicon; HfO2; SiON; angle-resolved X-ray photoelectron spectroscopy; concentration profile; hafnium oxide film; high-K dielectric material; interfacial layer; silicon oxynitride film; thermally grown silicon oxide; Chemicals; Dielectric materials; Electrochemical impedance spectroscopy; High K dielectric materials; High-K gate dielectrics; Nitrogen; Pollution measurement; Semiconductor films; Silicon; Thickness measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Semiconductor Manufacturing Conference and Workshop, 2003 IEEEI/SEMI
  • ISSN
    1078-8743
  • Print_ISBN
    0-7803-7681-1
  • Type

    conf

  • DOI
    10.1109/ASMC.2003.1194486
  • Filename
    1194486