DocumentCode :
3390338
Title :
Characterisation of silicon oxynitrides and high-k dielectric materials by angle-resolved X-ray photoelectron spectroscopy
Author :
Mack, P. ; White, R. ; Wolstenholme, J. ; Wright, A.
Author_Institution :
Thermo VG Sci., East Grinstead, UK
fYear :
2003
fDate :
31 March-1 April 2003
Firstpage :
154
Lastpage :
159
Abstract :
Angle-resolved X-ray photoelectron spectroscopy (ARXPS) has been used to characterise nondestructively silicon oxynitride and high-k film samples. Film thickness values and concentration profiles were determined in each case. Different chemical states of nitrogen were identified in the silicon oxynitride sample and concentration profiles and dose values for each nitrogen state were calculated. ARXPS was also used to study the difference between hafnium oxide films deposited on thermally grown silicon oxide and on HF-etched silicon. The thickness and chemistry of the interfacial layers were characterised.
Keywords :
X-ray photoelectron spectra; dielectric thin films; hafnium compounds; silicon compounds; HF-etched silicon; HfO2; SiON; angle-resolved X-ray photoelectron spectroscopy; concentration profile; hafnium oxide film; high-K dielectric material; interfacial layer; silicon oxynitride film; thermally grown silicon oxide; Chemicals; Dielectric materials; Electrochemical impedance spectroscopy; High K dielectric materials; High-K gate dielectrics; Nitrogen; Pollution measurement; Semiconductor films; Silicon; Thickness measurement;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Advanced Semiconductor Manufacturing Conference and Workshop, 2003 IEEEI/SEMI
ISSN :
1078-8743
Print_ISBN :
0-7803-7681-1
Type :
conf
DOI :
10.1109/ASMC.2003.1194486
Filename :
1194486
Link To Document :
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