Title :
Endura XP: enabling high 300 mm semiconductor productivity and reliability for manufacturing excellence
Author :
Tice, F. ; Hagerty, Chris
fDate :
31 March-1 April 2003
Abstract :
The Endura XP is Applied Materials´ next-generation 300 mm metal deposition system optimized for high volume production. The system combines a new Factory Interface (FI) with two vacuum wafer handling robots controlled by modern system software. With the Endura XP, chipmakers are able to operate advanced wafer processing sequences (e.g. copper deposition on low x dielectric) with high wafer throughput for low-cost, high yield semiconductor manufacturing. This paper outlines the challenges and requirements for the development of the Endura XP system for optimizing productivity with high throughput and reliability.
Keywords :
copper; industrial robots; integrated circuit manufacture; integrated circuit metallisation; materials handling; process control; production control; reliability; 300 mm; Cu; Cu deposition; Endura XP system; advanced wafer processing sequences; factory interface; high reliability; high volume production; high wafer throughput; high yield semiconductor manufacturing; low-cost semiconductor manufacturing; low-k dielectric; metal deposition system; productivity optimisation; system software; vacuum wafer handling robots; Dielectric materials; Inorganic materials; Production facilities; Production systems; Productivity; Semiconductor device manufacture; Semiconductor device reliability; Semiconductor materials; Throughput; Vacuum systems;
Conference_Titel :
Advanced Semiconductor Manufacturing Conference and Workshop, 2003 IEEEI/SEMI
Print_ISBN :
0-7803-7681-1
DOI :
10.1109/ASMC.2003.1194491
