• DocumentCode
    3390476
  • Title

    Study on the Reliability of Integration between Smart Micro-Grid and Distribution Network

  • Author

    Chen Bo ; Cheng Luwen ; Wu Zhigang ; Lin Lingxue ; Wang Rui ; Chen Zeng

  • Author_Institution
    Electr. Power Res. Inst., CSG, Guangzhou, China
  • fYear
    2012
  • fDate
    27-29 March 2012
  • Firstpage
    1
  • Lastpage
    5
  • Abstract
    The general definition and operational characteristics of distributed generations (DGs) and micro-grid are summarized in this paper. Three technical requirements are proposed to achieve the most reliable interconnection between micro-grid and the external grid. A typical analysis model of micro-grid containing wind power generation and photovoltaic generation is built and simulated based on EMTDC/PSCAD. Through simulation the general requirements of reliability between the micro-grid and the external grid is tested and verified. Other particular requirements that contribute in the reliable interconnection between micro-grid and the external grid in terms of power electronic device, power quality, relay protection and control strategy, etc, are also obtained in this paper. The conclusions gave in this paper are available for the reference on achieving reliable interconnection between the micro-grid and external grid.
  • Keywords
    distributed power generation; photovoltaic power systems; power distribution reliability; power generation reliability; power grids; power supply quality; power system interconnection; relay protection; wind power plants; DG; EMTDC-PSCAD; control strategy; distributed generations; distribution network; external grid; integration reliability; photovoltaic generation; power electronic device; power quality; relay protection; smart microgrid; wind power generation; Analytical models; Distributed power generation; Power system reliability; Reliability; Smart grids;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Power and Energy Engineering Conference (APPEEC), 2012 Asia-Pacific
  • Conference_Location
    Shanghai
  • ISSN
    2157-4839
  • Print_ISBN
    978-1-4577-0545-8
  • Type

    conf

  • DOI
    10.1109/APPEEC.2012.6307230
  • Filename
    6307230