• DocumentCode
    3390549
  • Title

    Image field upgrade to improve tool productivity

  • Author

    Dahmen, Michael J. ; Kenyon, Gareth O.

  • Author_Institution
    Process Eng. & Dev., Infineon Technol. Austria AG, Villach, Austria
  • fYear
    2003
  • fDate
    31 March-1 April 2003
  • Firstpage
    231
  • Lastpage
    233
  • Abstract
    Some semiconductor tools are used for the development of products and at the same time, stay a long time within production. Process requirements may change during the lifetime of a tool - photolithography of critical layers, for example, may get even more critical due to CD and overlay requirements. The same tool may now be used for non-critical layers, but productivity will always be important. Productivity is measured in wafers per hour (wph) and the image field size of a stepper plays a large role in this productivity. The main contribution of this paper is the realization that an increased image field size on an Ultratech 1X stepper gives increased wafers per hour on both a 5X Canon i-line reduction stepper and the 1X Ultratech stepper.
  • Keywords
    integrated circuit manufacture; optical images; photolithography; production; CD requirements; Canon i-line reduction stepper; Ultratech stepper; critical layers; image field size; image field upgrade; overlay requirements; photolithography; semiconductor tools; stepper throughput; tool productivity improvement; wafers per hour; Electronics industry; Focusing; Lead compounds; Lenses; Lithography; Process design; Production; Productivity; Size measurement; Throughput;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Semiconductor Manufacturing Conference and Workshop, 2003 IEEEI/SEMI
  • ISSN
    1078-8743
  • Print_ISBN
    0-7803-7681-1
  • Type

    conf

  • DOI
    10.1109/ASMC.2003.1194497
  • Filename
    1194497