DocumentCode
3390549
Title
Image field upgrade to improve tool productivity
Author
Dahmen, Michael J. ; Kenyon, Gareth O.
Author_Institution
Process Eng. & Dev., Infineon Technol. Austria AG, Villach, Austria
fYear
2003
fDate
31 March-1 April 2003
Firstpage
231
Lastpage
233
Abstract
Some semiconductor tools are used for the development of products and at the same time, stay a long time within production. Process requirements may change during the lifetime of a tool - photolithography of critical layers, for example, may get even more critical due to CD and overlay requirements. The same tool may now be used for non-critical layers, but productivity will always be important. Productivity is measured in wafers per hour (wph) and the image field size of a stepper plays a large role in this productivity. The main contribution of this paper is the realization that an increased image field size on an Ultratech 1X stepper gives increased wafers per hour on both a 5X Canon i-line reduction stepper and the 1X Ultratech stepper.
Keywords
integrated circuit manufacture; optical images; photolithography; production; CD requirements; Canon i-line reduction stepper; Ultratech stepper; critical layers; image field size; image field upgrade; overlay requirements; photolithography; semiconductor tools; stepper throughput; tool productivity improvement; wafers per hour; Electronics industry; Focusing; Lead compounds; Lenses; Lithography; Process design; Production; Productivity; Size measurement; Throughput;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Semiconductor Manufacturing Conference and Workshop, 2003 IEEEI/SEMI
ISSN
1078-8743
Print_ISBN
0-7803-7681-1
Type
conf
DOI
10.1109/ASMC.2003.1194497
Filename
1194497
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