DocumentCode
3390555
Title
The reverse and forward gate-diode drain current in ultra-thin LDD nMOSFET´s
Author
Chen Haifeng ; Du Huimin
Author_Institution
Sch. of Electron. Eng., Xi´an Univ. of Posts & Telecommun., Xi´an, China
fYear
2011
fDate
19-22 Aug. 2011
Firstpage
392
Lastpage
395
Abstract
The reverse and forward gated-diode drain (GDD) current in LDD NMOSFET with 1.4nm gate oxide have been studied. It is found that the reverse GDD current increases sharply with decreasing the gate voltage VG when the channel is in the accumulation region and the forward GDD current increases sharply with increasing VG when the channel is in the inversion region. These phenomena are different from that of the device with the thick gate oxide. In the accumulation region, the reverse GDD current is very large because of the large gate-induced drain tunneling (GIDL) current induced by the thin gate oxide. The forward VG effectively make the drain PN junction forward biased due to thin gate oxide when the channel is in the inversion region in the case of the forward GDD current. Then the large PN junction current is generated and this leads to the forward GDD current increases quickly with increasing VG.
Keywords
MOSFET; interface states; p-n junctions; forward gate-diode drain current; gate-induced drain tunneling current; reverse gate-diode drain current; thin gate oxide; ultra thin LDD nMOSFET; Current measurement; Electron traps; Junctions; Logic gates; MOSFET circuits; Substrates; Tunneling; GIDL; LDD; accumulation; gated-diode; inversion;
fLanguage
English
Publisher
ieee
Conference_Titel
Mechatronic Science, Electric Engineering and Computer (MEC), 2011 International Conference on
Conference_Location
Jilin
Print_ISBN
978-1-61284-719-1
Type
conf
DOI
10.1109/MEC.2011.6025483
Filename
6025483
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