Title :
An overview of thermal management for next generation microelectronic devices
Author :
Tonapi, S.S. ; Fillion, R.A. ; Schattenmann, F.J. ; Cole, H.S. ; Evans, J.D. ; Sammakia, B.G.
Author_Institution :
Gen. Electr. Global Res., Niskayuna, NY, USA
fDate :
31 March-1 April 2003
Abstract :
The need for smaller, faster and lighter products has put considerable demands on the thermal management of microelectronics. This paper outlines the issues in thermal management of consumer and aerospace electronics. Some typical solutions for complex high-end systems are presented. The role of the thermal interface material is a key to the thermal management of high performance consumer electronics and is also addressed in this paper.
Keywords :
consumer electronics; thermal management (packaging); aerospace electronics; complex high-end system; consumer electronics; electronic packaging; microelectronic device; thermal interface material; thermal management; Aerospace materials; Costs; Electronic packaging thermal management; Electronics cooling; Electronics packaging; Microelectronics; Power dissipation; Power system management; Thermal management; Thermal management of electronics;
Conference_Titel :
Advanced Semiconductor Manufacturing Conference and Workshop, 2003 IEEEI/SEMI
Print_ISBN :
0-7803-7681-1
DOI :
10.1109/ASMC.2003.1194502
