The inductive connection effects of a mounted SPDT in a plastic SO8 package

Author

Ndagijimana, F. ; Engdahl, J. ; Ahmadouche, A. ; Chilo, J.

Author_Institution

LEMO-ENSERG, Grenoble, France

fYear

1993

fDate

14-15 June 1993

Firstpage

109

Lastpage

112

Abstract

An investigation of the electrical performance of an assembled SO8 package with a single-pole, double-throw (SPDT) switch is presented. Using an equivalent electric network for the whole assembly, the isolation and the insertion losses are computed for a signal frequency up to 5 GHz. From the modeling and simulation results, a significant effect of the path connection to ground is shown, and the required modifications of the connecting layout are discussed. The modeling concept is applicable to any single-chip package.<>

Keywords

MMIC; equivalent circuits; losses; modelling; packaging; semiconductor switches; 5 GHz; connecting layout; double-throw; electrical performance; equivalent electric network; inductive connection effects; insertion losses; isolation; modeling; mounted SPDT; path connection to ground; plastic SO8 package; simulation; single-chip package; single-pole; Assembly; Frequency; Inductance; Insertion loss; Integrated circuit modeling; Integrated circuit packaging; Joining processes; Plastic packaging; Strips; Switches;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave and Millimeter-Wave Monolithic Circuits Symposium, 1993. Digest of Papers., IEEE 1993

Conference_Location

Atlanta, GA, USA

Print_ISBN

0-7803-1322-4

Type

conf

DOI

10.1109/MCS.1993.247465

Filename

247465