• DocumentCode
    3391766
  • Title

    DC Surface Flashover Characteristics of Polyimide at Low Temperature under Vacuum

  • Author

    Rong Tan ; Guifeng Zhang ; Hao Zhang ; Youping Tu ; Meixin Luo

  • Author_Institution
    Beijing Key Lab. of High Voltage & EMC, North China Electr. Power Univ., Beijing, China
  • fYear
    2012
  • fDate
    27-29 March 2012
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    Polyimide (PI) is widely used as insulation in various superconducting power equipments for its excellent dielectric performance and mechanical properties. The cryogenic vacuum is the actual work environment of the insulation systems of superconducting power equipments. Therefore, the study of polyimide film´s DC surface flashover characteristics at low temperature in vacuum is of great significance. In this paper, a series of tests for studying polyimide film´s DC surface flashover characteristics have been done at temperatures from 78K to 300K in vacuum by using the home-made test system which is developed for testing cryogenic electrical characteristics of dielectrics. The test results show that the surface flashover times and temperature both have some influence on the DC surface flashover strength of polyimide films.
  • Keywords
    cryogenics; flashover; organic insulating materials; polymer insulators; superconducting devices; surface discharges; cryogenic electrical characteristics; cryogenic vacuum environment; dielectric electrical characteristics; dielectric performance; home made test system; low temperature under vacuum; polyimide film DC surface flashover; polyimide insulation; superconducting power equipment; temperature 78 K to 300 K; Flashover; Insulation; Polyimides; Surface treatment; Temperature distribution; Temperature measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Power and Energy Engineering Conference (APPEEC), 2012 Asia-Pacific
  • Conference_Location
    Shanghai
  • ISSN
    2157-4839
  • Print_ISBN
    978-1-4577-0545-8
  • Type

    conf

  • DOI
    10.1109/APPEEC.2012.6307291
  • Filename
    6307291